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HTC Butterfly 3 Specs Leaked By a Benchmark

Many HTC fans who didn't bought latest 2015 flagships One M9 and M9+ are still debating which device is better but according to latest reports it seems HTC’s upcoming Butterfly 3 will be more powerful than the both recently released flagships.

Yes, what you read above is correct, it seems HTC is getting ready to release a new flagship Smartphone as fourth iteration of Butterfly series. Rumours suggests upcoming Butterfly device will be released as Butterfly 3 and will be featuring most notable features than both flagships of 2015.


As per benchmark leak, Butterfly 3 will be borrowing Qualcomm’s Snapdragon 810 processor from One M9 while quad HD display will be from One M9+. Benchmark shows device is featuring 5.1 inches display which is exact between both flagships One M9 and M9+.  With Snapdragon 810 chipset device will be having 3GB of RAM.


A gigantic 20.7 MP sensor will be fitted on rear side of upcoming HTC’ flagships. Device will not have secondary rear shooter but front facing camera will be 12MP which is surely a treat for selfies lover. Well if the listed features are accurate, then for sure Butterfly 3 is the device you should plan to buy in first quarter of 2015.

One important detail which is still in dark is either Butterfly 3 will be built with same plastic material like its predecessors or Taiwanese manufacturer might built this high end device with their recent metal design language.

Would you like to buy Butterfly 3 with aforementioned specs if it is built with plastic material?
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