A couple of days ago, we have news that Samsung’s upcoming flagship Galaxy S7 Chinese and US market variants will be powered by Qualcomm’s latest Snapdragon 820 chipset whereas rest of the markets will be getting Exynos 8890 powered devices.
This year flagship Galaxy S6 variants were planned with Snapdragon 810 SoC but later on ended up with Exynos 7420 because of the overheating issue of the Qualcomm’s chipset. This year Samsung is very confident regarding snapdragon 820 performance.
According to the Chinese tipster posting on Weibo, The Qualcomm’s Snapdragon 820 powering Galaxy S7 consumes very less power and also have better thermal management as compared to its predecessor. This enhanced variant of Snapdragon 820 SoC will be running on the higher frequency than the normal version. To keep its temperature low, a heat pipe is included to keep it at normal temperature.
The Tipster posting further suggests the Galaxy S7 having Snapdragon 820 chipset performs impressively on Geek benchmark test. On single core test, it achieves an impressive score of 2456 points whereas on multi-core test it scores 5423. The authenticity of these scores is yet to confirmed as nothing is from an official source, so we will recommend you to take these scores with a pinch of salt.
On the other hand, if these scores are legit then Galaxy S7 customers in US and Chinese market won’t have to worry about the Snapdragon 820 SoC performance. The Korean Giant scheduled an unpacked event on February 21st, 2016, we can expect Galaxy S7 launch on this day. Stay tuned for more details.